IcePak

As electronic devices offer increased functionality in smaller form factors the associated higher power densities can give rise to significant heat generation that affects long term device operation and functionality. To help design individual components, board layouts and integrated systems that can effectively dissipate thermal energy, AltaSim combines its expertise in thermal analysis and computational fluid dynamics with practical experience in applying ANSYS IcePak software.

Ansys icepak electronics cooling

Fan assisted heat pipe design

 

Controlled dissipation of thermal energy may require the use of multiple approaches to obtain an effective solution. AltaSim has experience solving these complex problems in both natural and forced convection environments using ANSYS IcePak, as well as in the development of novel systems to dissipate thermal energy. Through the generation of highly accurate, conformal meshes of the electronic components and board details, power can be accurately distributed over the board or system. When coupled with computational analysis of fluid flow and all modes of heat transfer – conduction, convection and radiation – for both steady-state and transient thermal-flow simulations we are able to predict temperature distributions and heat fluxes to assist in the development of effective ways to dissipate thermal energy.

Ansys icepak electronics cooling

Natural convection flow in sealed module

 

Our knowledge of the most effective approach for developing the required level of detail for the application allows us to predict the effects of fluid flow and heat transfer at the component, board or system level, consequently AltaSim can provide:

  • Improved design
  • Optimized performance
  • Reduced need for physical prototypes and testing
  • Shortened time-to-market

Our expertise in this area has supported applications for products in manufacturing and processing industries, aerospace navigation and control systems, and consumer electronics products. Among the examples of applications that have been investigated are:

  • Heat sink optimization for passive cooling of power electronic circuits
  • Heat pipe design using fan assisted cooling
  • Component layout and PCB thermal via connectivity
  • Board assembly and lay up
  • Rack mounted system design

 

Ansys icepak electronics cooling

Module venting to optimize thermal dissipation due to forced air flow

 

If you are interested in speaking with us about developing solutions for electronics cooling challenges, then please complete our contact us form, or call.

 

 

 

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