Simulation of Thermal-Structure Interaction – July 17th
On Thursday, July 17th, Mechanical Engineering and COMSOL will give a free webinar on “Simulation of Thermal-Structure Interaction.”
Details and registration are available below.
Live Presentation – Thursday, July 17th, 2014, 2:00pm EDT
http://comsol.com/c/17br
Speakers:
Kyle C. Koppenhoefer from AltaSim Technologies
Shankar Krishnan, Applications Engineer, COMSOL
Multiphysics simulation can be used to model thermal-structure interaction and involves coupling structural analysis and heat
transfer. One application includes simulating thermal expansion in order to analyze thermally induced stresses in electronics, MEMS
devices, and machineries. In this webinar we will cover related topics, including thermal and mechanical contact. We will explore
features of COMSOL Multiphysics(R) that are needed for solving thermal-structure interaction problems. The webinar will include
a live demonstration showing how to set up such a problem, and will conclude with a Q&A session.
For more information and to register, visit: http://comsol.com/c/17br
If you are unable to attend the live event, register and you’ll receive notification once the recorded version is available.
Tomorrow’s technologies lend themselves to a growing need for multiphysics simulation, and both COMSOL and AltaSim Technologies are committed to helping more and more people become skilled in the use of COMSOL Multiphysics(R). We have just updated our Training Calendar for the next six months and invite our readers to check out and register for upcoming classes as an investment in the future of simulation. Excellence is not an accident. We want to help you get there.